MEGACHIPS ASIC TECHNOLOGY
We Bring Ideas to Silicon
Create what you imagine and transform the world we live in with MegaChips ASIC technology
FULL SERVICE COT
From wafer manufacturing to drop shipments
MegaChips is the ideal partner for all your COT needs
Let MegaChips simplify your operations. We offer complete services to help you manage your business effectively and efficiently. MegaChips provide fast, reliable access to the most advanced wafer processing, test and packaging. Our operations team assures that your products are shipped on time with the proper documents and packaging. Our logistics system provides backlog and WIP information so you always know what is in the line.
From wafer manufacturing to drop shipments
MegaChips offers
- Full service semiconductor supplier
- Over 26 years semiconductor experience
- Flexible business engagement model
- Extensive expertise and engineering resources
- Package Development
- Test and Qualification
- Fab and Manufacturing
- Supply chain management
- Manufacturing
- Testing
- Quality and Reliability
- Shipments
Engineering Services
Our engineering teams act as an extension of your engineering team. They provide a seamless transition between our organizations to ensure that your design moves rapidly from concept to production.
We are with you every step of the way to support your development team to create and develop the ideal solution.
Operations Services
MegaChips can support a wide range of development programs from turnkey ASICs to COT services, where we provide wafer manufacturing, assembly, final test, and manage inventory and shipment to you or your customers.
Our team will work closely with your engineering team to assure that your development goes smoothly and that the resultant products meet your requirements.
Engineering Services
Advanced Packaging Technology
In many modern ASICs, the design of the package is as important as the design of the ASIC itself. MegaChips has extensive packaging experience, including:
- High-performance, flip-chip BGAs with ball counts in excess of 2000 balls,
- Multi-chip modules (MCMs) – multiple die in a single package
- Multi-package modules (MPMs) – multiple packaged devices put together in a single package
Stacked BGAs
MegaChips designs redistribution layers (RDLs) and BGA substrates itself, ensuring the final packaged device performs as expected. Design techniques we employ in RDL and substrate design include:
- Using substrate routing to overcome RDL trace length differences
- Specifying tolerances for substrate routing – example, Bus[31:0] to be within 1 mm of each other
- Using zig-zag routing to match lengths between different signals
Figure 1: MegaChips RDL Routing
Figure 2: MegaChips Substrate Routing
Figure 3: MegaChips MPM
Figure 4: MegaChips Stacked BGA
Testing
MegaChips’s ASIC testing methodology includes full scan insertion, memory BIST insertion, and Iddq testing. In addition to performing final high-speed testing, MegaChips also supports JTAG boundary scan register (BSR) insertion. Our state-of-the-art test center has dozens of test machines – including state-of-the-art Advantest and HP testers.
Scan
To help identify manufacturing defects, MegaChips is able to insert scan chains into the ASIC as a service to our customers. To minimize the effects of scan insertion on performance, we provide customers with pre-scan libraries that incorporate the effects of scan insertion on performance and die area. MegaChips also uses proprietary tools to prevent scan chain shift errors. We create vectors from the scan chain, which we use to test the ASIC before shipment to customers. MegaChips’s scan insertion techniques ensure very high fault coverage.
BIST
MegaChips uses BIST to test its memories for manufacturing defects. Our controller adds minimal overhead (about 1,000 gates) and a single controller supports dozens of memory blocks. Multiple controllers can be instantiated into hierarchical designs.
Iddq Testing
MegaChips uses advanced Iddq testing to help identify manufacturing defects in its ASICs. We use automatic address selection techniques to measure thousands of addresses. We also utilize fast DC measurement techniques to conduct Iddq testing in a quick and cost effective manner.
JTAG (IEEE 1149.1 compatible)
MegaChips’s JTAG support includes providing customers with the Test Access Port Controller, and BSDL files.
Engineering Product Qualification
MegaChips product and quality Engineers are there from the beginning to watch over the development and qualification during the design they are vigilent to make sure the DFT and reliability are given high priorites during the develoment. With an understanding of the quality requirements of the final product the product qualification is tailored to meet the quality and cost requirments of the device.
Working together our teams will develop the product qualification requirement and our QA department will do the testing based on the the corner lot requirements our team will conduct extensive electrical, parametrical, envirponmenat and stress related tests to assure that your products will operate as expected in all the required operating conditions.
MegaChips will provide detailed product qualification reports and if necessary make product recommendations to improve the quality, reliability and yield of your device.
Engineering RMA Service
Should you ever need it our Quality and product engineers are there for you. We manage all the logistics of handling your RMAs. We can take the lead or if you prefer pick up from your issuance of the RMA number. Our staff will evaluate the failure and determine the root cause whether if is related to customer use, environmental or design factors.
Once the root cause has been determined we will work with you to determine the best course of action:
- Additional handling instructions to your customer
- Modification of the test procedure
- Corrective action during the manufacturing process
- Design modification
Whatever the root cause of remedial action MegaChips it there for you ane with you during the entire process.
Contact Us
Contact us with questions, or for guidance or to start your ASIC COT project today!
Operations Services
Operations Front-End
MegaChips front-end service can provide support for all your product development needs from selecting the best IP to product qualification. Our highly qualified team will support your development before, during and after tapeout. MegaChips manages all the operational issues so that you can focus on creating and developing your product.
Our team will work closely with your engineering team to assure that your development goes smoothly and that the resultant products meet your requirements.
Operations Back-End
MegaChips has been delivering high performance semiconductor devices for more than 27 years and can handle all of your back-end operational requirements from wafer fabrication to production shipments of cost-effective, high-quality devices. Our efficient operations staff can handle the most complex requirements and assure timely delivery of your devices.
Just in time (JIT) delivery guarantees your parts are on the dock when they are needed. MegaChips staff is there at every step through the entire operations process to manage all the scheduling and WiP updates.
Our product engineering team is working with you during the entire project to help improve test yield and manufacturability.
Operations Logistics
MegaChips handles all of the logistics from managing inventory, making on-time shipments to you or directly drop shipping the parts to your end customers with your paper work.
Our operations interface provides you with a real time WiP status so you always know where your products are and when they are planned to ship.
If there is ever a problem, our team can provide RMA management from the initial request to the final report, and determine the root cause as well as recommend corrective or preventative actions.
Contact Us
Contact us with questions, or for guidance or to start your ASIC COT project today!
